It’s Not Slop. It’s Kudzu

Three tech giants demonstrate optical die-to-die interconnect for AI scale-up

Lumentum, Qualcomm, and Corning will showcase a high-density optical die-to-die interconnect designed to extend AI system bandwidth beyond electrical limits. The demonstration at ECOC 2026 features VCSEL-based optical engines and aims to support roughly 1 Tb/s/mm of bandwidth density with a path to 4 Tb/s/mm.

Sep 25, 2026